Nikon Optistation-3000 Wafer Inspection System

Key Features

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Enhanced Macro Observation Functions

In addition to macro surface inspection, the system comes standard with perimeter inspection and the center of wafer back sides.

The control of rotation speed and tilt angle during macro inspection can be manually adjusted from the default position using a joysitck.


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High Transfer Stability

The OPTISTATION-3000 inherits a system that boasts the high system stability and high-transfer rate, proven in front in front end process, of the review system OPTISTATION series.

The system provides the highest system reliability in its class, using a safety design that complies with SEMI standards.


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Extra-long Working Distance Lens

Objectives

CFI LU Plan Bright Field/Dark Field Objectives

Magnification Numerical Aperture Working Distance
5x 0.15 18mm
10x 0.30 15mm
20x 0.45 4.50mm
50x 0.80 1.00mm
100x 0.90 1.00mm

CFI LU Plan APO Bright Field/Dark Field Objectives

Magnification Numerical Aperture Working Distance
150x 0.9 0.42mm

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New System Enables Transfer of Warped Wafers

A new robotic arm for transferring warped wafers has been developed on proprietary Nikon technology.

Nikon's special robotic arm, wafer contact technology, and support sequence enable the safe and sure transfer of highly warped wafers.


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Combined Transfer for 200-300mm Wafers on a Single Unit

Loading a 200-mm cassette adapter enables the combined transfer of 200-300mm wafers on a single unit.

There is no need for bothersome adjustments when making inch-size changes thanks to the load port's auto recognition of cassettes and the design of two-size shared parts. System uptime is thereby dramatically improved.


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