Manufacturing equipment from steppers to the most sophisticated inspection systems has given Nikon invaluable experience in the field of microelectronics. This experience has allowed Nikon to become a worldwide leader in microelectronics technology and in the manufacture of advanced instruments designed specifically for the production and inspection of semiconductors and flat panel displays.
Modular reflected light microscope systems for wafer inspection and materials science applications.
Fabrics/Textiles, Metallurgy, MEMS, Liquid Crystal Displays, Medical Devices, Optoelectronics…
300mm wafer and mask inspection microscope systems for reflected light defect identification.
200mm wafer and mask inspection microscope systems for reflected light defect identification.
An upright microscope with dynamic auto-focus that brings fast, versatile focus to the Eclipse LV semiconductor inspection microscope series and OEM applications.
Non-contact, fully automated wafer carrier measuring system.
Advanced IC inspection wafer loader capable of loading 100µm thin wafers.
Automatic macro inspection system with high throughput and exceptional sensitivity.
300mm wafer inspection system featuring Nikon's renowned CFI60 optics and newly designed DUV microscope.
Compact, cost-effective solution for 300mm wafer inspection in diverse applications.
An inspection system and analysis tool for R&D defect analysis delivering high-speed transfer and system stability.
300mm inspection station delivering high precision, throughput, accuracy and ease of use.
Compact wafer inspection solution featuring exceptional accuracy and high throughput at a modest price.
Designed for automated pattern profile management and line width roughness monitoring of 300mm wafers.
IC inspection wafer loader capable of handling 8- and 6-inch (200 and 150 mm) wafers.
IC inspection wafer loader for 6- to 4- inch (150 and 100 mm) wafers.
Semiconductor wafer inspection software offering features such as image archiving, defect review, post probe review and online communications.