Parole chiave: Chip, wafer, FOUP, LED illumination
Definizione:Standard mechanical interface: A term applied, in particular, to technologies used in semiconductor manufacturing enabling automated transport and transfer of wafers and wafer container in environmentally controlled conditions
TECHNOLOGY:
SMIF technology was developed in the 1980s to create mini clean environments for housing and transporting silicon wafers. A SMIF pod is a container (usually made of transparent plastic) designed to accommodate silicon wafers of a particular size and which can be accessed by automated mechanical interfaces from production equipment. Each pod has a number of standard recognition points such as coupling plates, pins holes and / or electronic tags that can be recognized by robotic machinery. SMIF technology minimises human handling and allows wafers to remain inside an environmentally controlled and contamination-free environment. A SMIF pod has a bottom-opening door so that when a SMIF pod is placed on a port on a manufacturing tool, a cassette containing the wafers can be lowed into the device and the wafers removed by robotics. SMIF pods are used for wafer of 200mm or less. Larger wafers employ a FOUP to accommodate the greater flexibility of larger diameter wafers.
APPLICATIONS:
In automated semiconductor manufacturing environments and cleanrooms.
MICROSCOPE CONFIGURATION:
The Nexiv video measuring systems provide the precision, accuracy and speed required for applications in semiconductor manufacturing.
RECOMMENDED SYSTEM:
The NEXIV VMR-C4540 is suitable for the inspection and measurement of 200mm wafer carriers with a SMIF pod base and 300mm Front Opening Unified Pod (FOUP) & Front Opening Shipping Box (FOSB) wafer carriers. By incorporating laser AF that provides quick non-contact focusing, even on transparent surfaces and on the edge of the peripheries of the wafer, the VMR-C4540 is able to measure semi-standard dimensions with excellent accuracy.
• Four side planes of the carrier are continuously measured by rotating the kinematic plate in 90° increments
• SEMI-compliant kinematic plate provides perfect X,Y,Z coordinates
• Variety of illumination choices enable accurate measurements of registration pin holes and latch-key holes
• Laser AF provides fast, non-contact measurements of wafer positions
• Wide area, high-intensity LED illumination enables accurate measurements of wafer heights