Parole chiave: Chip, wafer, SMIF
Definizione:A FOUP is a type of SMIF pod for transporting / containing the larger 300mm wafers. It is used in automated manufacturing/inspection/cleanroom environments
TECHNOLOGY:
FOUP (front opening unified pod) and FOSB (front opening shipping box) are wafer carriers used in automated semiconductor manufacturing environments. FOUPs appeared with the first 300mm wafer processing tools in the 1990s and differ from standard SMIF pods in the position of the access point (front rather than bottom opening). Every FOUP has SMIF ports (coupling plates, pins and holes (and / or electronic tags) that enable the FOUP to be located on a load port) and to be manipulated by an automated handling system. A FOUP creates a controlled, contamination-free environment where the wafers are protected from external airflow. Correct manufacture of FOUPs to exact specifications with accurately positioned wafers is critical to an automated environment using precision robotic devices. FOUPs may be subject to deformation as a result of ageing. FOUP inspection is, therefore, a critical aspect of the automated manufacturing process.
APPLICATIONS:
FOUPs are used in automated semiconductor environments for the transportation and containment of 300mm wafers.
MICROSCOPE CONFIGURATION:
The Nexiv video measuring systems provide the precision, accuracy and speed required for applications in semiconductor manufacturing.
RECOMMENDED SYSTEM:
Nikon’s NEXIV VMR-C4540 has been designed for use with 300mm Front Opening Unified Pod (FOUP) & Front Opening Shipping Box (FOSB) wafer carriers and is also suitable for 200mm wafer carriers and a SMIF pod base. By incorporating laser AF that provides quick non-contact focusing, even on transparent surfaces and on the edge of the peripheries of the wafer, the VMR-C4540 is able to measure semi-standard dimensions with excellent accuracy.
• Four side planes of the carrier are continuously measured by rotating the kinematic plate in 90° increments
• SEMI-compliant kinematic plate provides perfect X,Y,Z coordinates
• Variety of microscope illumination choices enable accurate measurements of registration pin holes and latch-key holes
• Laser AF provides fast, non-contact measurements of wafer positions
• Wide area, high-intensity LED illumination enables accurate measurements of wafer heights