Nikon Instruments / Products / Semiconductor Systems / Semiconductor Equipment / Optistation-3200

Optistation-3200

Optistation-3200 Specifications

Wafer size: OD 300mm
Microscope (micro) inspection: Total magnification: 25x to 1500x; Inspection modes: Brightfield, Darkfield, DIC (option), DUV (option); Autofocus: LED illumination slit projection; Objectives: CFI60 objectives
Macro inspection: Surface Macro, center backside Macro, perimeter backside Macro
Load port: 2 FOUP; Position selectable from side or rear
Wafer transfer: Robotic handling; vacuum chuck; noncontact pre-alignment mechanism
Options: DUV microscope: Hg-Xe lamp type (248nm); Online operation: Via SECS-I or HSMS; Others: Video capture function, 2nd user interface (UIF), OHV (SEMI E84 compliance), Review inspection, ADC, OCR
Safety: S2-0302 compliance, CE marking compliance
Ergonomic: S8-0701 compliance
Dimensions (W x D x H): 1625 x 2500 x 2300mm; (Rear load port) (64.0 x 98.4 x 90.6 in.)

AMS en change location

Email Updates

Nikon Instruments Inc. on LinkedIn