Optistation-3000 Specifications
| Wafer size |
300 mm (SEMI / M1.15 / t = 750 -20 µm), 200 mm (SEMI / Please contact Nikon concerning the transfer of non-standard size wafers.) |
|---|---|
| Standard cassette types | FOUP, FOSB, and FFO |
| Micro inspection | Surface, backside, edge, and macro image capture functions |
| Wafer alignment | Non-contact alignment |
| Wafer transfer system | High-speed, multi-axis robot |
| Microscope | Nikon L300 300mm wafer inspection microscope (brightfield/darkfield and DIC observation) |
| Expandability | 200mm wafer transfer, deformed wafer transfer, and thin wafer transfer |
| Power usage |
Power supply: 200 VAC -10%, max. 10A, 50/60 Hz Vacuum: -66.7 kPa/-30 Nl/min |
| Stage | Manual vacuum contact stage with 360° rotation |
| System reliability | MTBF 1500 hours, Up time > 95% |
