NWL200 Specifications
| Compatible wafer size | |
|---|---|
| Diameter | 200mm / 150mm* |
| Thickness (standard) | 300µm |
| Thickness (thin wafer option) | 300～100µm |
| Compatible carrier | SEMI 25 (26) wafer carrier** |
| Centering | Non-contact, photoelectric sensors |
| Notch/orientation flat detection | Non-contact, photoelectric sensors |
| Operation/display section | Wafer slot buttons and interactive LCD interface |
| External dimensions (WxDxH) | 535mm x 626mm x 350mm |
| Weight | 50kg |
| Safety standards |
Electrical safety: CE mark compatible SEMI: S2-0706, S8-0307, F47 compatible Laser safety: FDA Class 1 |
| Utilities |
Power supply: AC 100240 V, 50/60 Hz, 1.5 A0.7 A Vacuum: -80kPa Connection tube diameter: Ø 6mm |
* For Ø125mm wafers and non-silicon wafers, please contact your nearest Nikon distributor.
** For other carriers, please contact your nearest Nikon representative.
