The NWL-860 has been discontinued.
NWL-860 Specifications
| Wafer Size: | 8 to 6 inches (conforms to both SEMI and JEIDA) |
|---|---|
| Wafer Cassette: | Fluoroware PA182-60MB, Fluoroware PA192-80M |
| Inspection Mode - NWL-860T: | Micro Inspection |
| Inspection Mode - NWL-860TM/860TM SP: | Micro Inspection, Tilt Macro Inspection |
| Inspection Mode - NWL-860TMB: | Micro Inspection, Tilt Macro Inspection, Back Side Center Macro Inspection, Back Side Periphery Macro Inspection |
| Inspection Mode - NWL-860TMB INX: | Micro Inspection, Tilt Macro Inspection, Back Side Center Macro Inspection, Back Side Periphery Macro Inspection, SMIF Elevator |
| Wafer Transfer: | Robotic transfer with vacuum chuck |
| Pre-alignment: | Non-contact pre-alignment |
| Orientation Flat/Notch Detection: | By transmitted type sensor; wafer angle before and after inspection can be specified in increments of 90° |
| Stage: | Dedicated state (rotatable 360°, with vacuum chuck) |
| Dimensions and Weight: | Main unit: 530 W x 620 D x 275mm H, 50 kg (INX type: 786 W x 752 D x 442mm H, 60 kg); Footprint 900 W x 620mm D (INX type: 1450 W x 800mm D) |
| Vacuum: | Pressure: - 600mm Hg (-80 kPa) or less, Displacement: 10nl/min. or more |
| Power Source: | AC 100V/120V, 220V/240V + 10%, 50/60 Hz, 3.5A max. |
