Nikon’s field-proven image processing technology, driven by AI, is now applied to device inspection. Our unique learning function quantifies the acceptable value of "good wafer image" results for each process, providing the versatility needed to respond to process changes and deliver stable inspection results.

Capturing the entire wafer surface in a single image provides one of the world’s highest throughputs for an automatic macro inspection system (150 wafers/hour), enabling 100% lot inspection.

Nikon’s exclusive diffracted light detection system detects pattern variation, due to defocus by the stepper or uneven coating by the coater, with excellent sensitivity. Our proprietary algorithms accurately recognize diffracted light from the top pattern layer, making it possible to identify defects in underlying patterns.

In addition to the ADC function, users can specify their own rework criteria for each process. Adjusting the threshold of the defect criteria in the recipe provides automatic rework judgments in wafer and lot units.

• Automatic Defect Classification (ADC)
• AGV capable
• Wafer ID Reader, Cassette ID Reader
• Edge bead removal inspection (EBR)
• Signal Tower, Remote terminal
• Online interface